b 7 - 4 19.07.01 ? by semikron skiip 792 gb 170 - 373 ctv absolute maximum ratings symbol conditions 1) values units v isol 4) ac, 1min 4000 v t op , t stg operating / stor. temperature -25...+85 c igbt and inverse diode v ces 1700 v v cc 5) operating dc link voltage 1200 v i c igbt 750 a t j 3) igbt + diode -40...+150 c i f diode 750 a i fm diode, t p < 1 ms 1500 a i fsm diode, t j = 150 c, 10ms; sin 6480 a i 2 t (diode) diode, t j = 150 c, 10ms 210 kas 2 driver v s1 stabilized power supply 18 v v s2 non-stabilized power supply 30 v f smax switching frequency 11,0 khz dv/ dt primary to secondary side 75 kv/s characteristics symbol conditions 1) min. typ. max. units igbt v (br)ces driver without supply 3 v ces - - v i ces v ge = 0, t j = 25 c v ce = v ces t j = 125 c - - - 45 3 - ma ma v ce0 t j = 125 c - 1,77 - v r c t j = 125 c - 5,5 - m w v cesat i c = 600 a, t j = 125 c - 5,1 - v v cesat i c = 600 a, t j = 25 c - - 3,85 v e on + e off v cc =900/1200v, i c = 750 a t j = 125 c - 634 / 976 - mj c chc per skiip, ac side - 2,4 - nf l ce top, bottom - 5 - nh inverse diode 2) v f = v ec i f = 600 a; t j = 125 c - 1,89 - v v f = v ec i f = 600 a; t j = 25 c - - 2,90 v e on + e off i f = 750 a; t j = 125 c - 90 - mj v to t j = 125 c - 0,90 - v r t t j = 125 c - 1,6 - m w thermal characteristics r thjs 10) per igbt - - 0,027 c/w r thjs 10) per diode - - 0,089 c/w r thsa 6,10) p16 heatsink; see case s3 - - 0,036 c/w driver i s1 supply current 15v-supply 260 + 590 * f s / f smax + 1,3 *i ac /a ma i s2 supply current 24v-supply 200 + 430 * f s / f smax + 1,0 *i ac /a ma t interlock-driver interlock-time 3,0 s skiippack protection i tripsc short circuit protection 938 2% a i triplg ground fault protection - a t trip over-temp. protection 115 5% c u dctrip 9) u dc -protection 1225 2% v mechanical data m1 dc terminals, si units 4 - 6 nm m2 ac terminals, si units 8 - 10 nm skiippack a a sk integrated intelligent power pack halfbridge skiip 792 gb 170 - 373 ctv 7,9) preliminary data case s3 features short circuit protection, due to evaluation of current sensor signals isolated power supply low thermal impedance optimal thermal management with integrated heatsink pressure contact technology with increased power cycling capability, compact design low stray inductance high power, small losses over-temperature protection 1) t heatsink = 25 c, unless otherwise specified 2) cal = controlled axial lifetime technology (soft and fast) 3) without driver 4) driver input to dc link / ac output to dc link / ac output to heatsink 5) with semikr on-dc link (low inductance) 6) other heatsinks on request 7) c - integrated current sensors t - temperature protection v - 15 v or 24 v power supply 8) ac connection busbars must be connected by the user; copper busbars available on request 9) options available for driver: u - dc link voltage sense f ? fiber optic connector 10) ? s ? referenced to temperature sensor
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